Thermal simulation
Our Thermal simulation services ensures best-in-class thermal
engineering by providing precise thermal simulation. We offer
product level and PCB level simulations with approximating worst-
case operating conditions. We will ensure that your product
never exceeds the safe operating limits.
PCB Failure analysis
Reliability is the base criterion for the success of
any product. Regular design cycles often miss
worst-case operating conditions, which can lead to
Field failures. The Field failures are often due to
the factors like EOS (Electrical Overstress), ESD
(Electro Static Discharge), Thermal Stress,
Mechanical Stress, premature Aging of
components, Environment, etc. We provide
consultancy for failure analysis and developing
countermeasures that helps to manufacture
reliable products.